HSn75-2 complex copper alloy is a copper-based alloy whose main components are copper (Cu) and tin (Sn). This alloy is 75% tin and is a low lead copper alloy. HSn75-2 alloy has excellent mechanical properties, good corrosion resistance and good casting properties. It is usually used in the manufacture of electronic components, conductive materials, communication equipment and chemical equipment and other fields.

Chemical Composition of HSn75-2 Complex Copper Alloy

HSn75-2 is a complex copper alloy whose chemical composition mainly includes copper (Cu), tin (Sn) and phosphorus (P).

Among them, copper (Cu) is the main basic element, accounting for most of the total composition of the alloy.

Tin (Sn) is an additive element that can improve the strength, hardness and corrosion resistance of the alloy, and can also improve the wear resistance of the alloy.

Phosphorus (P) is a phosphating agent that improves tin dispersion and copper corrosion resistance.

Mechanical properties of HSn75-2 complex copper alloy

HSn75-2 complex copper alloy has excellent mechanical properties, which are mainly reflected in the following aspects:

High strength: HSn75-2 alloy has high yield strength and tensile strength. Its material has high hardness and high strength indicators such as tensile and shear resistance, and is suitable for engineering applications requiring high strength.

Good wear resistance: HSn75-2 alloy has high wear resistance, can resist friction and wear, and prolong service life.

Good corrosion resistance: HSn75-2 alloy has good corrosion resistance, can resist the erosion of various corrosive media, and is suitable for working in corrosive environments.

Good fatigue resistance: HSn75-2 alloy has good fatigue resistance, that is, it can still maintain good strength and ductility under long-term stress, and is suitable for working environments that are often subject to deformation and vibration.

Good machinability: HSn75-2 alloy has good machinability, and can be processed into parts of different shapes through forging, casting, heat treatment and other processes, and is suitable for processing parts requiring complex shapes.

Physical Properties of HSn75-2 Complex Copper Alloy

HSn75-2 is a complex copper alloy whose physical properties include the following:

Density: The density of HSn75-2 is about 8.8 g/cm3, which is slightly higher than that of pure copper.

Elastic modulus: The elastic modulus of HSn75-2 is about 135 GPa, which is slightly higher than that of pure copper, indicating that it has certain strength and stiffness.

Melting point: The melting point of HSn75-2 is about 910-1050°C, which is relatively high, which makes it have good high temperature resistance.

Thermal expansion coefficient: The thermal expansion coefficient of HSn75-2 is about 17-19×10^-6/℃, which is similar to pure copper and has good stability when the temperature changes.

Conductivity: The conductivity of HSn75-2 is about 27-36 MS/m, slightly lower than pure copper, but still has good conductivity.

Hardness: The hardness of HSn75-2 is about 80-120 HB, which is relatively low and easy to process and form.

What are the characteristics of HSn75-2 complex copper alloy?

HSn75-2 is a complex copper alloy whose features include:

High strength: HSn75-2 has high strength and can meet the requirements of various applications.

Good corrosion resistance: The alloy has good corrosion resistance and can maintain good performance under harsh environmental conditions.

Good thermal conductivity: HSn75-2 has good thermal conductivity and is suitable for applications that require good heat dissipation.

High wear resistance: The alloy has high wear resistance, which can prolong the service life of components.

Good machinability: HSn75-2 is easy to cast, press, forge and machine, and can be made into parts of various shapes and sizes.

In conclusion, HSn75-2 complex copper alloy has the characteristics of high strength, good corrosion resistance, good thermal conductivity, high wear resistance, and good machinability, etc., and is suitable for applications in various industrial fields.

Electrical Conductivity of HSn75-2 Complex Copper Alloy

HSn75-2 is a copper alloy whose electrical conductivity is determined by its composition and microstructure.

The main components of HSn75-2 copper alloy are copper and tin, and the content of tin is 2%. As an alloying element, tin can significantly improve the strength and corrosion resistance of copper. At the same time, the addition of tin will also have a certain impact on the conductivity.

Copper has excellent electrical conductivity and is one of the commonly used conductive materials in the electrical industry. The addition of tin will have a certain negative impact on the conductivity of copper, because a local galvanic couple will be formed between tin and copper, and a certain resistance will be generated at the grain boundary. Therefore, compared to pure copper, the electrical conductivity of HSn75-2 copper alloy may be slightly worse.

In addition, the electrical conductivity of HSn75-2 copper alloy is also affected by its microstructure. Heat treatment and cold working of the alloy can change the grain size and grain boundary characteristics of the alloy, thereby affecting the electrical conductivity. In general, finer grains and fewer discontinuous grain boundaries help improve the electrical conductivity of copper alloys.

Thermal conductivity of HSn75-2 complex copper alloy

HSn75-2 is a complex copper alloy with high strength and high thermal conductivity. Its main components include copper (Cu), tin (Sn) and nickel (Ni). HSn75-2 alloy has good strength and thermal stability at high temperature and is suitable for thermal conductivity applications in high temperature environments.

The thermal conductivity of HSn75-2 alloy depends on its composition and microstructure. Copper is a good thermal conductor and has a high thermal conductivity. The addition of tin and nickel can improve the strength and heat resistance of the alloy, but their thermal conductivity is relatively poor.

In addition, the thermal conductivity of HSn75-2 alloy is also affected by many factors, such as the grain size of the alloy, the content and distribution of non-metallic elements, and the heat treatment state of the alloy. The thermal conductivity of HSn75-2 alloy can be further improved by proper alloy design and optimization of heat treatment process.

Application of HSn75-2 Complex Copper Alloy

HSn75-2 complex copper alloy is a tin-containing high-strength copper alloy with excellent mechanical properties and corrosion resistance. It is used as follows:

Wire and Cable: HSn75-2 alloy has excellent electrical conductivity and is often used to make high-performance wire and cable, especially in high temperature and corrosive environments.

Ship and ocean engineering: Because HSn75-2 alloy has good corrosion resistance and seawater corrosion resistance, it is often used in the manufacture of seawater systems, cooling systems and reverse osmosis equipment in ships and ocean engineering.

Automotive industry: HSn75-2 alloy is widely used in the automotive industry for the manufacture of engine coolers, exhaust systems, condensers and fuel systems, etc.

Petroleum and chemical industry: HSn75-2 alloy has high temperature resistance and corrosion resistance, and is often used in the manufacture of heat exchangers, pipes, valves and other equipment in the petroleum and chemical industry.

Construction engineering: HSn75-2 alloy is often used in the manufacture of plumbing systems, heating systems and air conditioning systems in buildings due to its corrosion resistance and high strength.